JS27HPAG08SFDA-45-SU

Memory IC Overview

The JS27HPAG08SFDA-45-SU is a 16Gb (2GB) Single-Level Cell NAND Flash memory featuring an x8 I/O interface and ONFI 1.0 compliance. It operates at a supply voltage of 1.8V with a range of 1.7V to 1.95V. The device utilizes a 63-ball FBGA package measuring 9.0mm by 11.0mm. Key specifications include a page size of 4KB plus 256 bytes of spare area, a block size of 256KB plus 16KB, and support for multiplane operations across four stacked dies.

Memory IC Feature Summary

• Supports multiplane architecture enabling parallel programming and erasing across multiple planes to reduce operation time.
• Includes Read Cache functionality to improve read throughput for large files by loading data into a cache register.
• Features hardware write protection via the WP# pin to prevent unintended program or erase operations.
• Provides internal error correction code (ECC) support for 4-bit correction per 528 bytes.

Memory IC Applications

• Solid state mass storage applications
• Embedded systems requiring cost-effective non-volatile memory
• Industrial control systems operating within extended temperature ranges

Memory IC Procurement Notes

Verify that the specific part number matches the required density and package configuration. Confirm compatibility with the host controller's ONFI 1.0 command set and electrical requirements. Ensure the design supports the necessary power supply decoupling and signal integrity for the 63-ball FBGA footprint. Check for any specific NDA requirements regarding security features like unique IDs.

Memory IC Selection Notes

Select this component when a high-density, low-voltage NAND solution with x8 interface is required. Consider the multiplane capabilities if system performance benefits from parallel operations. Verify that the industrial temperature range meets the environmental constraints of the target application. Ensure the host system can manage the ECC requirements and block management algorithms typical for SLC NAND devices.

Memory IC Part Context

This device belongs to the JS27HPxG08SF-SU family, which includes 4Gb, 8Gb, and 16Gb variants. All members share the same physical package dimensions and core interface protocols. The primary distinction lies in the internal die stacking configuration, with the 16Gb version utilizing a Quad Die Package (QDP) structure to achieve its capacity while maintaining a single chip enable pin.

Memory IC Replacement Considerations

Direct substitutes within the same series include the JS27HP4G08SFDA-45-SU and JS27HP8G08SFDA-45-SU, provided the system can accommodate the lower densities. Cross-manufacturer replacements require verification of ONFI 1.0 compatibility, voltage levels, and package pinout alignment.