JSMC04AUM1ASAED-H5-SU

Memory IC Overview

The JSMC04AUM1ASAED-H5-SU is a 4GB embedded MultiMediaCard (eMMC) compliant with JEDEC eMMC 5.1 standards, utilizing a single 32Gb NAND die. It features an integrated controller and Flash Translation Layer for wear leveling and bad block management. The device supports HS400 interface modes at 200MHz clock frequency with 8-bit bus width, achieving up to 400 MB/s throughput. It operates on dual supply voltages: VCCQ (1.7V–1.95V or 2.7V–3.6V) for the controller and VCC (2.7V–3.6V) for flash memory. The component is housed in an 8.0 x 10.0 x 1.0 mm 153-ball FBGA package.

Memory IC Feature Summary

• Supports HS400 high-speed DDR interface timing mode for enhanced data transfer rates.
• Includes built-in Flash Translation Layer managing wear leveling, bad block management, and ECC.
• Features dedicated Boot and RPMB partitions alongside user data areas.
• Provides secure delete capabilities including Sanitize, Secure Erase, and Secure Trim operations.

Memory IC Applications

• Embedded storage solutions requiring eMMC 5.1 compliance
• Mobile devices and handheld electronics
• Industrial control systems operating within commercial temperature ranges
• IoT gateways and edge computing hardware

Memory IC Procurement Notes

Verify that the specific ordering suffix matches the required package dimensions and temperature grade. Confirm host system compatibility with the 1.8V or 3.3V VCCQ supply options if HS400 speeds are required. Ensure design reviews account for the 153-ball FBGA footprint and signal integrity requirements for high-speed interfaces.

Memory IC Selection Notes

Select this model when a compact 8x10mm form factor is necessary for space-constrained designs. Choose this variant over the larger package version only if board real estate is limited. Verify that the application environment remains within the specified commercial temperature range of -25°C to 85°C during operation.

Memory IC Part Context

This component belongs to the JSC 4GB eMMC product line designed for embedded NAND applications. It offers backward compatibility with eMMC 4.5 and 5.0 specifications while introducing advanced features like Field Firmware Update and High Priority Interrupts. The device integrates both the NAND flash and controller into a single package to simplify system development.

Memory IC Replacement Considerations

JSMC04AUM1ASAEA-H5-SU serves as a direct physical replacement offering identical electrical characteristics but utilizes a larger 11.5x13.0mm package. Designers must verify PCB layout compatibility before substituting between the 'D' and 'A' package variants.