LDB182G5010G-120

Balun Overview

The LDB182G5010G-120 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 2.3 GHz to 2.7 GHz and provides an impedance transformation from 50 Ohms to 100 Ohms. The component utilizes surface mount technology (SMD/SMT) and is housed in a 0603 package, corresponding to the 1608 metric dimension.

Balun Feature Summary

• Provides balanced-to-unbalanced signal conversion for RF applications
• Integrates 50 Ohm to 100 Ohm impedance matching functionality
• Utilizes chip multilayer hybrid construction for compact integration

Balun Applications

• RF front-end modules requiring differential signaling
• Wireless communication systems operating in the 2.4 GHz band
• Bluetooth and Wi-Fi interface circuits

Balun Procurement Notes

This component is scheduled for obsolescence and will be discontinued by the manufacturer. Procurement should focus on verifying final time buy availability or transitioning to alternative designs. Verify current stock levels with authorized distributors as supply may be limited.

Balun Selection Notes

Select this part only if the specific 2.3 GHz to 2.7 GHz frequency range and 50/100 Ohm impedance ratio align with the circuit requirements. Due to its obsolete status, engineers must evaluate long-term supply chain risks and consider redesigning with active components for new production volumes.

Balun Part Context

The LDB182G5010G-120 belongs to the LDB18 series of chip multilayer hybrid baluns. These components are designed for high-frequency RF applications where size constraints are critical. The series typically offers reliable performance in compact surface-mount packages suitable for modern electronic devices.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Given the obsolete status, users should consult Murata's official replacement guides or engineering support for recommended cross-reference components.