LDB183G7010C-110

Balun Overview

The LDB183G7010C-110 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 3.4 GHz to 4 GHz, supporting applications in the RF and wireless spectrum. The component features an impedance configuration of 50 Ohms for the unbalanced port and 100 Ohms for the balanced port. It exhibits a maximum insertion loss of 1.2 dB. The device is designed for surface mount installation with physical dimensions of 1.6 mm in length, 0.8 mm in width, and 0.6 mm in height. It functions reliably across an operating temperature range from -40 °C to +85 °C.

Balun Feature Summary

• Multilayer hybrid construction for compact signal conditioning
• Integrated conversion between 50 Ohm unbalanced and 100 Ohm balanced ports
• Surface mount design optimized for automated PCB assembly

Balun Applications

• RF signal path balancing in wireless communication modules
• Signal conditioning for high-frequency transceivers
• Integration into compact mobile device antenna systems

Balun Procurement Notes

Verify component authenticity through authorized Murata distributors or certified supply chain partners. Confirm RoHS compliance status and lifecycle stage prior to procurement. Ensure storage conditions maintain integrity against moisture sensitivity levels specified in manufacturer documentation. Cross-reference part numbers carefully to avoid substitution errors with similar series components.

Balun Selection Notes

Select this component when a balanced-to-unbalanced transformation is required at frequencies between 3.4 GHz and 4 GHz. Consider the specific impedance requirements of 50 Ohm and 100 Ohm ports for circuit matching. Evaluate the physical footprint constraints against the 1.6 x 0.8 x 0.6 mm package size. Assess thermal performance needs against the -40 °C to +85 °C operational range.

Balun Part Context

This balun belongs to Murata's line of passive RF components designed for modern wireless infrastructure. It addresses the need for efficient signal conversion in miniaturized electronic devices. The multilayer technology allows for high reliability and consistent performance in mass-produced consumer electronics and industrial communication equipment requiring stable RF characteristics.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Murata resources for current equivalent listings.