LDB311G8020C-409

Balun Overview

The LDB311G8020C-409 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for signal conditioning applications. It operates at a frequency of 1.8 GHz with an impedance of 200 Ohms. The component utilizes SMD/SMT termination and is housed in a 1206 (3216 Metric) package. It functions within a minimum operating temperature of -40 C and a maximum operating temperature of +85 C.

Balun Feature Summary

• Multi-layer hybrid construction utilizing copper conductors and ceramic materials
• Designed for high-frequency RF/IF and RFID applications

Balun Applications

• RF/IF circuits
• RFID systems

Balun Procurement Notes

Verify the specific ordering suffix to ensure correct packaging configuration. Confirm that the requested part number matches the required impedance and frequency specifications for the target application. Check current availability status as distribution may vary by region.

Balun Selection Notes

Select this component when a 200 Ohm balanced-to-unbalanced conversion is required at 1.8 GHz. Ensure the design accommodates the 1206 footprint and the specified thermal operating range from -40 C to +85 C for reliable performance.

Balun Part Context

This device belongs to the LDB series of chip-type multi-layer hybrid baluns. These components are engineered for high-performance signal integrity in compact form factors, suitable for modern electronic devices requiring efficient RF signal processing.

Balun Replacement Considerations

Consult official Murata documentation for direct substitutes. Verify compatibility of impedance, frequency, and package dimensions before replacing.