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LFE5U-85F-7BG554C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Lattice Semiconductor Corporation. Its product description is IC FPGA 259 I/O 554CABGA. Review the specifications below when checking this part for your BOM.
The LFE5U-85F-7BG554C is a Field Programmable Gate Array belonging to the Lattice ECP5 family. It features 83,600 logic elements and 41,800 Adaptive Logic Modules (ALMs). The device includes 3.66 Mbits of embedded memory, comprising 669 kbits of distributed RAM and 2,976 kbits of Embedded Block RAM (EBR). It supports 365 I/O pins with a maximum data rate of 3.2 Gb/s. Operating at a core voltage between 1.045 V and 1.155 V, it functions within a temperature range of -40°C to +100°C. The unit is housed in a 756-ball CABGA package.
Verify the specific suffix 'C' against official Lattice documentation to confirm it denotes the commercial temperature grade (-40°C to +100°C) rather than an industrial variant. Ensure the package type matches the required PCB footprint. Confirm RoHS compliance status through the manufacturer's current datasheet or certification documents before finalizing procurement orders.
Select this model when design requirements exceed the capacity of smaller ECP5 devices but do not necessitate the higher density of the 135K variant. Verify that the 756-ball CABGA package fits the mechanical constraints. Compare power consumption estimates against the 85F-7BG756I if a larger package is acceptable, as pin counts and I/O availability differ significantly between the 554 and 756 ball options.
This component is part of the Lattice ECP5 Ultra series, designed for cost-sensitive applications requiring moderate logic density and high-speed interfaces. It succeeds earlier ECP families by offering improved performance per watt. The 'LFE5U' designation identifies it specifically within the ultra-low-power segment of the broader ECP5 portfolio, targeting bridging and acceleration tasks.
Publicly confirmed direct substitutes include the LFE5U-85F-7BG756I, which offers identical logical resources but utilizes a 756-ball package. Designers must account for pinout differences and board layout changes when transitioning between the 554-ball and 756-ball packages. No other cross-family replacements are verified without schematic rework.
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