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LM3311SQX-HIOP/NOPB is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG BOOST ADJ 2A 24WQFN. Review the specifications below when checking this part for your BOM.
The LM3311SQX-HIOP/NOPB is a DC-DC switching regulator manufactured by Texas Instruments, classified as an adjustable boost converter. It features a fixed output current capability of 2A and supports a maximum power rating of 24W. The device is housed in a 24-pin WQFN package designed for surface-mount technology. It operates with an adjustable output voltage range and includes integrated protection features typical of modern switching regulators.
Verify the specific suffix HIOP against the official Texas Instruments datasheet to confirm pinout compatibility and functional specifications. Ensure the ordering part number matches the exact package variant required for your PCB footprint. Cross-reference the manufacturer's latest documentation to validate RoHS compliance status and any recent design changes or lifecycle notices associated with this specific revision.
Select this component when a compact solution for boosting lower input voltages to higher levels is required. Consider the 2A current limit and 24W power ceiling to ensure it meets the load demands of the target application. Evaluate the thermal performance within the WQFN package relative to the expected ambient temperature and board layout constraints.
This part belongs to the LM3311 family of switching regulators from Texas Instruments. It is distinct from other variants such as the standard LM3311SQX/NOPB by its specific packaging and operational characteristics defined by the HIOP suffix. The family is designed for efficient power management in space-constrained environments.
Direct substitutes include the LM3311SQX/NOPB and LM3311SQX-HIOP/NOPB. Verify that alternative parts match the 24W power rating and 2A current capability. Ensure the replacement maintains the same WQFN-24 package dimensions and pin configuration to avoid PCB redesign.
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