M2S150TS-FCG1152I

Soc System On Chip Overview

The M2S150TS-FCG1152I is a SmartFusion 2 System-on-Chip FPGA from Microchip Technology, featuring 150K logic elements and an integrated ARM Cortex-M3 microcontroller subsystem. It utilizes low-power flash technology for non-volatile configuration. The device operates within a junction temperature range of -40°C to 100°C (Industrial grade) and supports up to 16 SerDes lanes with embedded DDR3 memory controllers. Key electrical specifications include a core supply voltage (VDD) of 1.14V to 1.26V and I/O bank voltages ranging from 1.14V to 3.45V depending on the standard.

Soc System On Chip Feature Summary

• Integrated ARM Cortex-M3 processor with 512 KB Flash and 64 KB RAM
• 150K Logic Elements with up to 5 MB embedded RAM
• Supports up to 16 high-performance SerDes lanes
• Industrial temperature grade (-40°C to 100°C)

Soc System On Chip Applications

• Secure industrial control systems requiring real-time processing
• Automotive infotainment and gateway applications
• Telecommunications infrastructure with hard DDR3 interfaces
• Aerospace and defense platforms needing radiation-tolerant flash technology

Soc System On Chip Procurement Notes

Verify the specific suffix 'TS' indicates data security density features as per the IGLOO 2 and SmartFusion 2 design security densities table. Confirm export compliance requirements, as this product may require additional documentation for export from the United States. Check current production status and lead times directly with Microchip or authorized distributors.

Soc System On Chip Selection Notes

Select this model for designs requiring both FPGA fabric and a hard ARM Cortex-M3 core in an industrial temperature environment. Ensure power supply rails meet the recommended operating conditions: VDD between 1.14V and 1.26V, and appropriate VPP levels (3.15V–3.45V) for programming and operation. Verify thermal management capabilities given the junction-to-air thermal resistance values for the FCBGA-1152 package.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 SoC FPGA family, which combines a mainstream FPGA fabric with a Microcontroller Subsystem (MSS). It shares the FCBGA-1152 package form factor with other high-density devices like the MPF500TS series but differs by integrating an ARM Cortex-M3 core instead of relying solely on soft-core processors or pure FPGA logic.

Soc System On Chip Replacement Considerations

Parametric equivalents listed for similar packages include M2S150T-1FC1152 and M2S150-1FCG1152. Verify if the specific 'TS' data security variant is required; otherwise, standard density versions may be functionally compatible if security features are not critical.