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M52-5003945 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN RCPT 39POS 0.05 GOLD PCB. Review the specifications below when checking this part for your BOM.
The M52-5003945 is a 39-position female socket receptacle connector from the Harwin Archer M52 series. It features a 1.27 mm (0.05 inch) pitch and utilizes gold-plated contacts for reliable signal transmission. The component is designed for through-hole mounting on printed circuit boards, ensuring secure mechanical attachment. This single-row header assembly provides robust connectivity for electronic applications requiring high-density interface solutions.
Verify the exact part number against official Harwin documentation to confirm pin count and termination style. Ensure compatibility with mating male headers regarding pitch and row configuration. Check for specific environmental ratings if operating in extreme conditions. Confirm RoHS compliance status via the manufacturer datasheet before integration into regulated products.
Select this component when a 39-position through-hole female socket is required. The 1.27 mm pitch suits applications needing dense pin arrangements without excessive board space usage. Gold plating is preferred for environments demanding long-term reliability. Consider the Archer series design for its proven track record in high-reliability sectors.
This connector belongs to the M52 Archer family, known for high-performance interconnects. The series offers various configurations including different pin counts and termination types. The M52-5003945 specifically addresses needs for medium-density through-hole applications within the broader Harwin portfolio of precision connectors.
Direct substitutes include other M52 series variants with matching 1.27 mm pitch and 39 positions. Verify that alternative parts maintain identical gold plating specifications and through-hole termination requirements to ensure functional interchangeability without redesigning the PCB footprint.
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