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MAAM-011305-TR1000 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is IC RF AMP GPS 30MHZ-8GHZ 8DFN. Review the specifications below when checking this part for your BOM.
The MAAM-011305-TR1000 is a general-purpose RF amplifier IC from MACOM Technology Solutions, designed for operation within the 30MHz to 8GHz frequency range. It features a gain of 15.25dB and a noise figure of 3.4dB. The device operates on a supply voltage of 3V to 5V with a current consumption of 65mA. Key performance metrics include a P1dB of 20dBm. It is housed in an 8-PDFN (2x2) package with exposed pad, suitable for surface mount installation.
Verify the complete part number including the -TR1000 suffix against official MACOM documentation to ensure correct packaging configuration. Confirm that the 8-PDFN package dimensions align with your PCB footprint requirements. Check the latest datasheet for any updates regarding test conditions or recommended operating parameters before finalizing the design.
Select this component when a wide bandwidth covering up to 8GHz is required alongside moderate gain levels. The low noise figure makes it suitable for applications where signal integrity is critical. Ensure the design can accommodate the specific thermal requirements of the exposed pad DFN package and the specified DC bias conditions.
This model belongs to the MAAM-011305 series of broadband RF amplifiers. It is manufactured by MACOM Technology Solutions and is currently listed as an active product. The device is intended for use in modern wireless systems requiring compact surface-mount solutions with reliable high-frequency performance.
Consult official MACOM substitution guides for verified alternative part numbers. Do not assume pin-compatible replacements without verifying electrical specifications and thermal characteristics against the original datasheet.
The device supports a supply voltage range of 3V to 5V.
Yes, the 8-PDFN package includes an exposed pad for improved thermal dissipation.
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