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MAX396C/D is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is INTEGRATED CIRCUIT. Review the specifications below when checking this part for your BOM.
The MAX396C/D is a precision, low-voltage CMOS analog multiplexer featuring 16 single-ended channels. It operates with a single supply from +2.7V to +16V or dual supplies of ±2.7V to ±8V. The device guarantees a maximum on-resistance of 100Ω at +25°C and maintains flatness within 10Ω over the signal range. Key electrical characteristics include a transition time of less than 250ns, charge injection of 5pC maximum, and off-leakage current below 1nA at +85°C. It provides TTL/CMOS logic compatibility and electrostatic discharge protection exceeding 2000V.
Verify the specific suffix 'D' indicates a die configuration rather than a packaged component. Confirm that the C suffix corresponds to the commercial temperature range of 0°C to +70°C. Ensure the source documentation explicitly supports the availability of this specific die variant before proceeding with integration plans.
Select the MAX396C/D when a 16-channel multiplexer is required in a bare die format. This part is suitable for designs needing low on-resistance and fast switching speeds under single or dual supply conditions. Verify that the application can accommodate the necessary PCB space and thermal management for die-level mounting compared to packaged alternatives.
The MAX396C/D belongs to the MAX396/MAX397 family of precision analog switches manufactured by Maxim Integrated. While the MAX397 offers dual 8-channel configurations, the MAX396 provides a single 16-channel solution. Both share identical fabrication processes and core performance metrics, differing primarily in channel count and pin assignments.
The MAX396C/D is functionally interchangeable with the MAX306, DG406, and DG506A in terms of pinout and basic specifications. However, verify that the replacement package type matches the design constraints, as these legacy parts are typically available in plastic DIP or SOIC formats rather than bare die.
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