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MAX4617EGE is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is HIGH-SPEED, LOW VOLTAGE, CMOS AN. Review the specifications below when checking this part for your BOM.
The MAX4617EGE is a high-speed, low-voltage CMOS analog multiplexer manufactured by Analog Devices Inc. (Maxim Integrated). It features an 8:1 single-ended configuration housed in a 16-pin QSOP package. The device operates on a single supply voltage ranging from 2V to 5.5V. Key electrical specifications include a maximum on-resistance of 10 ohms and a channel-to-channel matching of 200 milliohms. Switching times are specified with a maximum turn-on time of 15ns and a turn-off time of 10ns. The component exhibits low charge injection of 3pC and off-state leakage current of 1nA. It supports an industrial operating temperature range of -40°C to +85°C.
Verify the specific suffix 'EGE' against official Analog Devices documentation to confirm the exact package type and temperature grade. Ensure compatibility with existing board layouts regarding pin assignments and thermal requirements. Cross-reference with authorized distributors to confirm current availability and authenticity of the component.
Select this component when an 8:1 multiplexer with low on-resistance and fast switching speeds is required. Consider the 16-pin QSOP package constraints for PCB design. Evaluate if the single-supply voltage range meets system power requirements. Compare against similar parts like the MAX4617ESE+ if surface-mount SOIC packaging is preferred over QSOP.
The MAX4617EGE belongs to the MAX4617 family of high-speed analog multiplexers. This series is designed for applications demanding low distortion and fast settling times. The EGE variant specifically denotes the QSOP package and industrial temperature rating within the broader product line managed by Analog Devices.
The MAX4617ESE+ is a verified alternative offering identical electrical characteristics in a 16-SOIC package. Verify pinout compatibility and thermal dissipation differences between QSOP and SOIC packages before substitution.
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