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MC100EPT25DTR2G is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists onsemi. Its product description is IC TRANSLATOR UNIDIR 8TSSOP. Review the specifications below when checking this part for your BOM.
The MC100EPT25DTR2G is a single-channel, unidirectional differential ECL to LVTTL level translator manufactured by onsemi. It operates within a supply voltage range of 3V to 3.6V for VCC and -5.5V to -3.0V for VEE. The device features a typical propagation delay of 1.1 ns with a maximum frequency exceeding 275 MHz. It provides a TTL output current capability of 24 mA and includes input pin safety clamping. The component is housed in an 8-TSSOP package and supports operation across a temperature range of -40°C to +85°C.
Verify the specific suffix DTR2G corresponds to the tape and reel packaging format required for automated assembly processes. Confirm that the 8-TSSOP footprint matches the target PCB layout dimensions. Ensure power supply sequencing adheres to datasheet recommendations regarding VEE application prior to VCC to prevent transient currents. Validate RoHS compliance status for the specific manufacturing batch if environmental regulations apply to the final product deployment.
Select this component when interfacing high-speed ECL sources with lower voltage LVTTL destinations. The device is suitable for applications requiring minimal propagation delay and robust drive capability. Consider the single-channel architecture for point-to-point connections. Evaluate the thermal dissipation requirements associated with the TSSOP package in dense layouts. Ensure the system power supplies can accommodate the specified negative voltage rail for proper ECL operation.
This part belongs to the MC100EPT series of level translators designed for high-speed digital interfaces. The series focuses on converting between ECL family standards and CMOS/TTL standards. These components are engineered for reliability in demanding electronic environments. The manufacturer utilizes advanced semiconductor processes to achieve fast switching speeds. The product line supports various packaging options to fit different board space constraints.
Check for MC100EPT25DG as a potential alternative in SOIC-8 packaging. Verify electrical compatibility and pinout alignment before substitution. Review datasheet differences regarding package thermal characteristics and mechanical dimensions. Ensure the substitute component meets the same voltage and speed specifications.
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