SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MCD20128PERDR5 is a side floor mount enclosure manufactured by Hoffman Enclosures, Inc. Constructed from galvanized steel with a powder-coated grey finish, it measures 2000 mm in height, 1200 mm in width, and 800 mm in depth. This multipurpose unit is designed for industrial environments requiring robust physical protection for electrical components.
Verify the exact dimensional requirements against the official nVent Hoffman datasheet before procurement. Confirm that the galvanized steel material and powder-coated finish meet the specific environmental protection standards required for the intended installation site. Ensure compatibility with existing mounting infrastructure.
Select this model when a tall, narrow footprint is required to minimize floor space usage while maintaining substantial internal volume. The side-mount orientation distinguishes it from standard front-access units. Consider the powder-coated finish for enhanced durability in harsh industrial settings compared to unpainted alternatives.
This component belongs to the Hoffman MCD series of multipurpose enclosures. It is part of a broader family of industrial housing solutions designed by nVent Hoffman. The series typically includes various sizes and configurations to accommodate different equipment densities and spatial constraints in industrial facilities.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with direct replacements by comparing dimensions, mounting hole patterns, and material specifications against the original manufacturer's data.

The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More