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MCIMX6DP4AVT8ABR is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU I.MX6DP 852MHZ 624FCBGA. Review the specifications below when checking this part for your BOM.
The MCIMX6DP4AVT8ABR is an i.MX 6DualPlus Automotive Applications Processor featuring four Arm Cortex-A9 cores operating at 852 MHz. It includes a 1 MB L2 cache, NEON MPE, and Vivante GC2000 3D GPU with OpenGL ES 3.0 support. The device integrates dual IPUv3H, VPU for 1080p video, and extensive interfaces including Gigabit Ethernet, SATA II, PCIe 2.0, and multiple USB ports. Packaged in a 21x21 mm FCPBGA, it supports DDR3/DDR3L/LPDDR2 memory and operates within the -40 to +125°C automotive temperature range.
Verify the specific suffix 'R' against official NXP documentation to confirm reel packaging or tape-and-reel specifications, as datasheets may not explicitly detail all packaging variants. Ensure compatibility with the IMX6DQPAEC data sheet for automotive qualification standards. Cross-reference the part number nomenclature to validate the DualPlus core configuration and 852 MHz speed grade before procurement.
Select this processor for graphics-intensive automotive applications requiring robust multimedia performance. It is suitable for designs needing integrated power management and advanced security protocols. Consider the 852 MHz frequency limit when using a 24 MHz clock source for USB functionality. Evaluate the available interface muxing options to ensure sufficient connectivity for target peripherals without resource conflicts.
This component belongs to the i.MX 6DualPlus/6QuadPlus family of Automotive Applications Processors. It shares architectural similarities with consumer and industrial variants but is distinguished by its automotive temperature rating and specific feature set. The 'DP' designation indicates the DualPlus core configuration, differentiating it from the QuadPlus series.
MCIMX6DP4AVT8AA is a lidded variant within the same series. MCIMX6DP4AVT1AB offers a higher 1 GHz speed grade. Verify pinout and thermal requirements when substituting between lidded and non-lidded packages.
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