MCIMX7U5CVP06SD

MCIMX7U5CVP06SD

$17.49
  • Description:IC I.MX 7ULP MAPBGA 393
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:252ef5fed9ae Category: Brand:

  
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Product Detailed Parameters

  • Description:IC I.MX 7ULP MAPBGA 393
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:-
  • Number of Cores/Bus Width:-
  • Speed:-
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:-
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:-
  • Operating Temperature:-
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:393-LFBGA
  • Supplier Device Package:393-VFBGA (14x14)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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MCIMX7U5CVP06SD

Overview

The MCIMX7U5CVP06SD is an industrial-grade microprocessor from the NXP i.MX 7ULP family, featuring a heterogeneous multicore architecture with ARM Cortex-A7 and Cortex-M4 processors. It operates within a junction temperature range of -40 to +105 °C and utilizes a 14 mm x 14 mm BGA package with a 0.5 mm pitch. The application domain supports up to 650 MHz, while the real-time domain reaches 200 MHz. Key specifications include 256 KB RAM in both domains, integrated GC7000 Nano Ultra GPU for 3D graphics, and extensive connectivity options including USB 2.0, MIPI DSI, and multiple serial interfaces.

Feature Summary

  • Heterogeneous multicore processing combining an application domain Cortex-A7 and a real-time domain Cortex-M4
  • Integrated Vivante GC7000 Nano Ultra GPU supporting OpenGL ES 2.0/1.1 and OpenVG 1.1
  • Industrial qualification with extended operating temperature range from -40 to +105 °C
  • Comprehensive security features including CAAM, secure boot, and tamper detection

Applications

  • Smart wearable devices requiring ultra-low power consumption
  • Personal health monitoring systems
  • Industrial IoT edge nodes
  • Battery-powered smart home appliances

Procurement Notes

Verify the specific silicon revision and mask set compatibility before integration, as errata may apply to certain production batches. Confirm that the 14x14mm BGA package footprint matches your PCB design constraints. Ensure thermal management solutions are adequate for the specified industrial temperature range. Cross-reference the ordering suffix to confirm the inclusion of the 3D GPU, distinguishing it from non-GPU variants.

Selection Notes

Select this component when both rich OS-based application processing and deterministic real-time control are required in a single chip. The i.MX 7ULP is ideal for applications demanding high graphical performance alongside low-power sensor management. Consider the separate power domains for optimizing energy efficiency. Evaluate the available external memory interfaces if larger storage capacity beyond internal SRAM is needed.

Part Context

This part belongs to the i.MX 7ULP Applications Processor—Industrial family. It shares the core architecture with the MCIMX7U3CVP06SD but includes the GC7000 3D GPU, whereas the latter lacks 3D graphics support. Both parts share the same package, pinout, and industrial temperature rating, differing primarily in multimedia capabilities.

Replacement Considerations

MCIMX7U3CVP06SD serves as a direct substitute if 3D graphics acceleration is not required for the application.

MCIMX7U5CVP06SDMCIMX7U5CVP06SD
$17.49
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