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MCP47CMB02-E/UN is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC DAC 8BIT V-OUT 10MSOP. Review the specifications below when checking this part for your BOM.
The MCP47CMB02-E/UN is a dual-channel, 8-bit buffered voltage output Digital-to-Analog Converter (DAC) featuring Multi-Time Programmable (MTP) nonvolatile memory and an I2C serial interface. It operates within a supply voltage range of 1.8V to 5.5V and supports Standard (100 kHz), Fast (400 kHz), and High-Speed (up to 3.4 MHz) communication modes. The device provides 1 LSB Integral Nonlinearity (INL) specification, configurable power-down modes, and Power-on/Brown-out Reset protection. It is housed in a 10-lead MSOP package and functions across an extended temperature range of -40°C to +125°C.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and temperature grade. Ensure compatibility with system voltage levels and I2C bus requirements before integration. Cross-reference the datasheet revision to confirm all electrical characteristics match design specifications.
Select this component when dual-channel analog output with nonvolatile retention is required. Verify that the 8-bit resolution meets application accuracy needs. Confirm that the I2C address configuration using A0/A1 pins fits the system topology. Check if the MSOP-10 package dimensions align with the PCB layout constraints.
This part belongs to the MCP47CXBXX family of 8-bit, 10-bit, and 12-bit DACs from Microchip Technology. The 'M' in the model number indicates the inclusion of MTP nonvolatile memory, distinguishing it from volatile RAM variants. The 'B' denotes the dual-channel configuration, while '02' specifies the 8-bit resolution.
Direct substitutes within the same family include MCP47CVB02-E/UN for volatile memory applications or MCP47CMD02-E/UN for SPI interface requirements. Ensure functional equivalence regarding channel count, resolution, and package footprint when considering alternatives.
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