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MM74HCT541MTC is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUF NON-INVERT 5.5V 20TSSOP. Review the specifications below when checking this part for your BOM.
The MM74HCT541MTC is an octal buffer and line driver manufactured by onsemi, belonging to the HCT logic series. It features eight non-inverting inputs with three-state outputs housed in a 20-TSSOP package. The device operates within a supply voltage range of 4.5 V to 5.5 V. Key electrical specifications include a propagation delay of 33 ns at 5 V, output currents of ±7.2 mA, and a maximum power dissipation of 500 mW. It supports surface mount installation and functions reliably across an operating temperature range from -40°C to +85°C.
Verify the specific suffix against official documentation, as the provided source material primarily references the MM74HCT541MTCX variant. Confirm that the absence of the 'X' suffix indicates tube packaging rather than reel or cut tape formats. Ensure the component matches the required RoHS compliance status and moisture sensitivity level before finalizing procurement orders.
Select this component when an octal buffer with three-state capability is required for system buses. The HCT series ensures compatibility with existing TTL logic systems while offering CMOS low power characteristics. Consider the TSSOP-20 package dimensions for PCB layout constraints and verify that the 500 mW power dissipation rating meets thermal requirements for the intended enclosure environment.
This part belongs to the MM74HCT541 family of octal buffers produced by onsemi. It serves as a digital logic interface component designed to isolate stages or drive loads on high-capacitance buses. The device is part of a broader portfolio of HCT logic ICs that bridge the performance gap between older TTL standards and modern CMOS technologies.
The MM74HCT541WMX offers identical logical functionality but utilizes a 20-SOIC package instead of TSSOP. Other compatible alternatives within the same logic family may exist, but pinout and package geometry must be verified to ensure physical interchangeability without redesigning the printed circuit board.
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