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MPC5554MZP112 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MCU 32BIT 2MB FLASH 416PBGA. Review the specifications below when checking this part for your BOM.
The MPC5554MZP112 is a 32-bit microcontroller from the NXP MPC5500 family, built on Power Architecture embedded technology. It features an e200z6 core operating at 112 MHz. The device integrates 2 MB of embedded flash memory with ECC and Read While Write (RWW) capability, alongside 64 KB of on-chip SRAM with ECC and a 32 KB cache. System resources include two enhanced time processor units (eTPUs) providing 64 I/O channels, a 64-channel eDMA controller, and a 40-channel dual enhanced queued analog-to-digital converter (eQADC). Communication interfaces comprise four DSPI modules, three FlexCAN modules, and two eSCI modules. The unit utilizes a 416-pin plastic ball grid array (PBGA) package.
Verify the specific suffix ZP112 against official ordering guides to confirm the 112 MHz frequency and 416-pin PBGA package configuration. Confirm temperature range requirements, as -40°C to 125°C is standard while -55°C to 125°C may require distinct part numbering. Ensure design compliance with the manufacturer's recommendation regarding new design usage for this legacy component.
Select this MCU when migrating from the MPC500 family to leverage software reuse and improved performance. Choose the MPC5554MZP112 for applications demanding high-speed processing combined with extensive peripheral integration, such as precise timing control via eTPUs and high-resolution ADC sampling. Evaluate the 416-pin BGA footprint constraints and thermal management requirements for the specified voltage domains.
This component belongs to the MPC5500 series of microcontrollers designed for automotive and industrial environments. It represents an evolution over the MPC500 series, offering significantly higher performance through advanced CMOS technology and the Power Architecture platform. The series is characterized by its focus on reducing cost per feature while maintaining reliability for safety-critical applications.
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult NXP official resources for current lifecycle status and potential obsolescence alternatives.
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