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MS50SFB-3Y32AIR is listed in the RF Transceiver Modules And Modems range at ChipApex. The manufacturer field lists Minewsemi. Its product description is RF nRF52832 BLUETOOTH LE MODULE. Review the specifications below when checking this part for your BOM.
The Minewsemi MS50SFB-3Y32AIR is a fully-certified Bluetooth 5.4 LE module based on the nRF52832 SoC. It features an ARM Cortex-M4F core, 512kB Flash, and 64kB RAM. Operating at 2400–2483 MHz with +4dBm output power, it supports U.FL antenna interfaces. Supply voltage ranges from 1.7V to 3.6V (or 1.8–3.9V per spec). Receive current is 5.4mA; transmit current is 5.3mA. Sensitivity reaches -96dBm. Range extends up to 60 meters in open space. Operating temperature spans -40°C to 85°C. Surface mount package.
Verify specific ordering suffixes against official datasheets to ensure correct antenna type and certification status. Confirm RoHS compliance and MSL level 2 handling requirements during storage. Check ECCN classification 5A992C for export control regulations. Ensure supply voltage matches system design constraints within the 1.7V to 3.9V range. Validate surface mount packaging specifications for assembly compatibility.
Choose this module when Bluetooth 5.4 LE certification is mandatory for target markets. Select for applications requiring high sensitivity (-96dBm) and extended range (up to 60m). Consider for designs needing integrated flash memory and robust ARM processing capabilities. Evaluate thermal operating range suitability for industrial environments spanning -40°C to 85°C.
Part of Minewsemi's Bluetooth LE module family utilizing Nordic nRF52832 chips. Designed for companies relying on enterprise-grade connectivity solutions. Offers BQB and KC certifications to enhance product safety and market readiness across different regions. Provides reliable short-range wireless communication capabilities.
MS50SFA-2Y32AI serves as a comparable alternative within the same manufacturer lineup. Both utilize the nRF52832 chipset and support Bluetooth v5.4 protocols. Verify antenna interface differences between U.FL and integrated ceramic patch types before substitution.
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