Memory IC MSR830AGC-1512 product image

MSR830AGC-1512

$532.98
  • Description:IC SRAM 1GBIT PAR 676BGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray

SKU:3c9d15074d36 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MSR830AGC-1512 is listed in the Memory IC range at ChipApex. The manufacturer field lists MoSys, Inc.. Its product description is IC SRAM 1GBIT PAR 676BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MSR830AGC-1512

  • Description:IC SRAM 1GBIT PAR 676BGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:1T-SRAM
  • Memory Size:1Gbit
  • Memory Organization:16M x 72
  • Memory Interface:Parallel
  • Clock Frequency:1.25 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:676-BGA
  • Supplier Device Package:676-BGA (27x27)
  • Access Time:2.7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MSR830AGC-1512

MSR830AGC-1512

Memory IC Overview

The MSR830AGC-1512 is a Bandwidth Engine 3 (BE3-RMW) Accelerator Engine from the BLAZAR family, featuring 1Gb SRAM capacity organized as 16M x 72b. It provides high-speed random access with a typical tRC of 2.7ns and supports up to 6.5 billion transactions per second. The device utilizes a high-bandwidth serial GCI interface capable of 25Gbps per lane, delivering up to 640 Gb/s throughput across two full-duplex ports. Optional embedded In-Memory Functions include BURST for sequential data movement and RMW for computational operations.

Memory IC Feature Summary

  • Integrates optional In-Memory Functions including BURST for sequential read/write operations and RMW for in-memory computational tasks such as ADD, SUB, and Compare.
  • Features a high-speed serial GCI interface that reduces I/O pin count significantly compared to parallel memories while maintaining high bandwidth efficiency.
  • Includes an on-device Auto-Adaptation mechanism to handle signal tuning without requiring external signal conditioning components.
  • Provides a transparent QDR-like parallel RTL interface managed by a supplied memory controller, simplifying integration into FPGA systems.

Memory IC Applications

  • Network search and traffic monitoring applications requiring high bandwidth data access
  • Security, firewall, and anomaly detection systems needing real-time line-rate analysis
  • FPGA acceleration for Xilinx and Intel platforms utilizing base-level compute functions
  • High-capacity buffering and statistics processing where low latency is critical

Memory IC Procurement Notes

Verify the specific suffix codes against official MoSys documentation to confirm exact speed grades, temperature ranges, and package variants. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer prior to ordering. Ensure the selected variant matches the required system interface specifications and thermal management capabilities.

Memory IC Selection Notes

Select this component when replacing multiple QDR or SyncSRAM devices to reduce board space and pin count. Consider the BE3 architecture if applications require embedded computational functions like RMW to minimize data movement latency. Evaluate the need for dual-port operation versus single-port usage to optimize interface lane utilization and system cost.

Memory IC Part Context

The MSR830AGC-1512 belongs to the BLAZAR family of Accelerator Engines, specifically the Bandwidth Engine 3 series. This family is designed to address memory bottleneck challenges in high-performance computing by combining high-density memory with embedded processing capabilities. It serves as a direct replacement for traditional parallel SRAM architectures in bandwidth-intensive environments.

Memory IC Replacement Considerations

The MSR830AGC-1512 is pin-compatible with the MSP230 (QPR8). It can replace eight 144Mb QDR/SyncSRAM devices in equivalent capacity configurations. Designers should account for the transition from parallel interfaces to the serial GCI protocol when migrating existing designs.

MSR830AGC-1512MSR830AGC-1512
$532.98
Buy Now

Recent News