MT29F128G08AKCABH2-10:A TR

Memory IC Overview

The MT29F128G08AKCABH2-10:A TR is a Micron SLC NAND flash memory device with a 128 Gbit density and 16G x 8 organization. It utilizes a parallel interface and is housed in a BGA package. The component operates within a temperature range of -40°C to +105°C, supporting industrial applications requiring high reliability and endurance for data storage.

Memory IC Feature Summary

• Single-level cell (SLC) architecture providing enhanced data retention and endurance compared to multi-level cell variants.
• High-density 128 Gbit capacity suitable for large-scale embedded storage requirements.
• Industrial-grade temperature rating ensuring stable operation in demanding environmental conditions.

Memory IC Applications

• Embedded systems requiring robust non-volatile storage
• Industrial control equipment
• Automotive electronics

Memory IC Procurement Notes

Verify the specific suffix 'TR' against official Micron documentation to confirm tape-and-reel packaging status, as standard datasheets may list tray or cut-tape options. Confirm RoHS compliance details directly with the manufacturer or authorized distributor. Ensure the part number matches the exact revision level required for your design to avoid compatibility issues with existing firmware or hardware interfaces.

Memory IC Selection Notes

Select this component when high endurance and data integrity are critical over raw cost efficiency. The SLC technology offers superior write cycles and retention characteristics. Consider the BGA footprint and pin count during PCB layout. Verify that the system power supply meets the voltage requirements specified in the electrical characteristics section of the official datasheet.

Memory IC Part Context

This part belongs to the Micron MT29F series of NAND flash memories. The series is designed for applications needing reliable, high-performance storage. The specific model indicates an 8-bit wide interface and a 128 Gbit capacity, distinguishing it from lower-density or wider-interface variants within the same product family.

Memory IC Replacement Considerations

Consult Micron's official cross-reference guides for verified substitutes. Ensure any replacement maintains the same density, interface type, and package dimensions. Verify that alternative parts meet the same industrial temperature specifications and endurance ratings.