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MT29F1T08EBLCHD4-QA:C is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 1TBIT FBGA. Review the specifications below when checking this part for your BOM.
The MT29F1T08EBLCHD4-QA:C is a NAND flash memory component manufactured by Micron Technology. It utilizes TLC (Triple-Level Cell) technology to provide a total storage capacity of 1 Terabit. The device is organized as 128G x 8 bits, offering high-density data storage capabilities within a single integrated circuit package. This specific part number indicates the QA grade variant, which typically denotes automotive or extended temperature specifications compared to standard commercial grades, though exact thermal ranges require datasheet verification. The memory interface and electrical characteristics are defined by the B58R Fortis Flash architecture.
Verify the specific QA grade requirements against your system's environmental constraints before procurement. Confirm RoHS compliance status directly with the manufacturer or authorized distributors, as regulatory documentation may vary by production batch. Ensure that the FBGA package dimensions match your PCB footprint design. Request official datasheets to validate electrical parameters and timing specifications for your specific application circuit.
Select this component when high-density storage is required in a compact form factor. The 128G x 8 organization suits systems needing wide data buses without complex interleaving. Consider the QA designation if operating in environments requiring extended reliability standards. Compare power consumption profiles against other TLC options in the B58R family to optimize system efficiency. Verify interface compatibility with existing controllers supporting this specific NAND architecture.
This component belongs to Micron's B58R Fortis Flash NAND series, designed for high-performance storage solutions. The MT29F1T08EBLCHD4-QA:C represents a specific capacity and grade within this lineup, utilizing advanced 3D NAND fabrication processes. It is part of Micron's strategy to deliver high-density memory for demanding storage applications.
Direct substitutes include other parts from the MT29F1T08EBLCHD4 family with different suffixes indicating varying grades or packaging, such as the -M:C or -R:C variants. Cross-referencing pinouts and electrical specifications is essential when considering alternative manufacturers.
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