MT29F256G08CJAABWP-12Z:A

Memory IC Overview

The MT29F256G08CJAABWP-12Z:A is a 256Gb (32G x 8) NAND flash memory component manufactured by Micron Technology. It utilizes Multiple-Level Cell (MLC) technology and adheres to the Open NAND Flash Interface (ONFI) 2.2 standard. The device features an asynchronous interface with a 48-pin TSOP package. Key organizational parameters include a page size of 8640 bytes, a block size of 256 pages, and two planes per device. Each plane contains 2048 blocks, resulting in a total of 16,384 blocks for the 256Gb density.

Memory IC Feature Summary

• Supports ONFI 2.2-compliant asynchronous I/O operations
• Employs MLC architecture for high-density data storage
• Features dual-plane organization for parallel processing efficiency

Memory IC Applications

• Embedded multimedia applications requiring high-capacity storage
• Industrial control systems needing reliable non-volatile memory
• Consumer electronics utilizing NAND flash for firmware or data retention

Memory IC Procurement Notes

Verify the specific suffix 'A' against official Micron documentation to confirm exact revision status and availability. Ensure compatibility with host controllers supporting ONFI 2.2 asynchronous modes. Confirm package integrity for the 48-pin TSOP form factor during inspection. Cross-reference the full part number with current product lifecycle notices to determine active production status.

Memory IC Selection Notes

Select this component when a 256Gb capacity with asynchronous interface is required. The MLC technology offers a balance between cost and performance for general-purpose storage. Verify that the system design supports the 8-bit data bus width and the specific voltage requirements associated with the asynchronous timing mode. Ensure thermal management aligns with the specified operating temperature range.

Memory IC Part Context

This part belongs to the Micron MT29F series of NAND flash memories, which includes various densities from 64Gb to 512Gb. The series supports both synchronous and asynchronous interfaces. The CJAAB suffix typically denotes specific package and temperature grade variations within the broader family. This specific model targets applications requiring robust, high-density storage solutions compatible with standard asynchronous NAND controllers.

Memory IC Replacement Considerations

Direct replacements must match the 256Gb density, 8-bit width, and ONFI 2.2 asynchronous interface. Verify pinout compatibility for the 48-pin TSOP package. Consider alternative Micron models within the MT29F series that share identical electrical characteristics and organizational structures.