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MT29FEN64GDKCAAXDQ-10:A TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT29FEN64GDKCAAXDQ-10:A TR
- Description：IC FLASH
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：FLASH
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
Memory IC datasheet and documents for MT29FEN64GDKCAAXDQ-10:A TR
Memory IC Overview
The MT29FEN64GDKCAAXDQ-10:A TR is a NAND flash memory integrated circuit manufactured by Micron Technology Inc. It features a storage capacity of 64Gb organized as 8G x 8 bits. The device utilizes a parallel interface and operates within a supply voltage range of 2.7V to 3.6V. It is housed in a 48-TSOP I package with surface mount installation. The component supports non-volatile data retention and functions within an operating temperature range of 0°C to 70°C (TA).
Memory IC Feature Summary
- Non-volatile NAND flash technology for persistent data storage.
- Parallel interface architecture for system integration.
- Surface-mount packaging suitable for automated assembly.
Memory IC Applications
- Industrial control systems requiring reliable embedded memory.
- Communication equipment needing robust data storage solutions.
- Smart devices utilizing embedded memory chips.
Memory IC Procurement Notes
Verify the specific ordering suffix and package type against official Micron documentation to ensure compatibility with design requirements. Confirm RoHS compliance status and moisture sensitivity level prior to procurement. Check for obsolescence notices or alternative package options if availability is constrained, as this component may have limited stock or end-of-life status.
Memory IC Selection Notes
Select this component when a 64Gb parallel NAND flash solution is required for industrial or communication applications. Ensure the system design supports the specified voltage range and thermal operating conditions. Consider the 48-TSOP I footprint during PCB layout. Validate that the parallel interface aligns with the host controller's capabilities and timing requirements.
Memory IC Part Context
This part belongs to Micron's NAND flash memory portfolio, designed for high-density storage needs. It serves as an embedded memory solution for various electronic systems. The specific model indicates a 64Gb density with parallel interface characteristics, distinguishing it from serial or other interface variants within the broader product family.
Memory IC Replacement Considerations
Check for direct substitutes such as the MT29F64G08CBAAAWP:A TR if available, though availability and exact pin-to-pin compatibility must be verified through official datasheets. Ensure any replacement matches the 64Gb capacity, parallel interface, and TSOP package constraints.
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