MT44K32M36RB-107E IT:A

Description：IC DRAM 1.125GBIT PAR 168BGA
Series：-
Mfr：Micron Technology Inc.
Package：Tray

SKU:3756f584578e Category: Memory IC Brand: Micron Technology Inc.

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Product introduction

MT44K32M36RB-107E IT:A is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 1.125GBIT PAR 168BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT44K32M36RB-107E IT:A

Description：IC DRAM 1.125GBIT PAR 168BGA
Series：-
Mfr：Micron Technology Inc.
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：RLDRAM 3
Memory Size：1.125Gbit
Memory Organization：32M x 36
Memory Interface：Parallel
Clock Frequency：933 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：1.28V ~ 1.42V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：168-TBGA
Supplier Device Package：168-BGA (13.5x13.5)
Access Time：8 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for MT44K32M36RB-107E IT:A

MT44K32M36RB-107E IT:A

Memory IC Overview

The MT44K32M36RB-107E IT:A is a 1.125 Gbit RLDRAM 3 device organized as 32 Meg x 36 with 16 internal banks. It operates at a maximum clock frequency of 933 MHz (tCK = 1.07ns) with a minimum cycle time of 8ns. The component utilizes a 168-ball BGA package and supports 1.35V VDD and 1.2V VDDQ supply voltages. It features an industrial temperature range of -40°C to +95°C.

Memory IC Feature Summary

Supports 1200 MHz DDR operation with 86.4Gb/s peak bandwidth in the x36 configuration
Includes integrated on-die termination (ODT) and output driver calibration capabilities
Features a JTAG interface compliant with IEEE 1149.1-2001 standards
Provides multiplexed and non-multiplexed addressing options

Memory IC Applications

High-performance networking equipment requiring low latency
Industrial control systems operating within extended temperature ranges
Telecommunications infrastructure utilizing common I/O architectures

Memory IC Procurement Notes

Verify the specific speed bin suffix E against the required system timing constraints, as it dictates the minimum cycle time. Confirm that the IT designation matches the operational temperature requirements for the target environment. Ensure the RB package type aligns with the PCB footprint design specifications.

Memory IC Selection Notes

Select this part when a 36-bit data width is required for high-bandwidth applications. The 16-bank architecture allows for efficient interleaving of operations. Consider the 1.2V I/O voltage level for power efficiency compared to older generation memory technologies.

Memory IC Part Context

This component belongs to the Micron RLDRAM 3 family, designed for high-speed parallel data processing. It serves as a specialized memory solution distinct from standard DDR or SDRAM types, offering deterministic latency suitable for signal processing and baseband applications.