MT53B256M32D1DS-062 XT:C TR

Memory IC Overview

The MT53B256M32D1DS-062 XT:C TR is a Micron LPDDR4 SDRAM component with an 8 Gbit density and 32-bit data bus width. It operates at a maximum clock frequency of 1.6 GHz and utilizes a WFBGA-200 package. The device supports a supply voltage up to 1.1 V and functions within a temperature range of -40°C to +95°C.

Memory IC Feature Summary

• Supports LPDDR4 mobile memory interface standards
• Provides high-speed data transfer capabilities via 32-bit bus architecture
• Designed for surface-mount installation in compact electronic systems

Memory IC Applications

• Mobile computing platforms requiring low-power memory solutions
• Embedded systems utilizing LPDDR4 technology
• Portable consumer electronics devices

Memory IC Procurement Notes

Verify the specific XT:C suffix against official Micron documentation to confirm exact operating temperature ranges and performance grades. Ensure compatibility with system power requirements and thermal constraints before procurement. Confirm availability status directly with the manufacturer or authorized distributors as lead times may vary.

Memory IC Selection Notes

Select this component when an 8 Gbit capacity with a 32-bit interface is required for LPDDR4 applications. Consider the WFBGA-200 package dimensions for PCB layout constraints. Evaluate the -40°C to +95°C operating range against environmental conditions. Compare against other MT53B series variants if different densities or pin configurations are needed.

Memory IC Part Context

This part belongs to the Micron MT53B series of LPDDR4 DRAM components. These devices are engineered for mobile and embedded applications demanding high bandwidth and energy efficiency. The series offers various density options and packaging styles to suit diverse design requirements while maintaining standard LPDDR4 electrical characteristics.

Memory IC Replacement Considerations

Consult Micron's official substitution guide for verified alternatives. Cross-reference specifications such as density, bus width, and package type to ensure functional equivalence. Verify that any substitute part meets the same temperature and voltage requirements.