Memory IC MT53E1G16D1FW-046 AAT:A TR product image

MT53E1G16D1FW-046 AAT:A TR

$15.71
  • Description:IC DRAM 16GBIT PAR 200TFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:c36d4f719ac9 Category: Brand:

  
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MT53E1G16D1FW-046 AAT:A TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT PAR 200TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53E1G16D1FW-046 AAT:A TR

  • Description:IC DRAM 16GBIT PAR 200TFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4X
  • Memory Size:16Gbit
  • Memory Organization:1G x 16
  • Memory Interface:Parallel
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:18ns
  • Voltage - Supply:1.06V ~ 1.17V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-TFBGA
  • Supplier Device Package:200-TFBGA (10x14.5)
  • Access Time:3.5 ns
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for MT53E1G16D1FW-046 AAT:A TR

MT53E1G16D1FW-046 AAT:A TR

Memory IC Overview

The MT53E1G16D1FW-046 AAT:A TR is a Micron LPDDR4 SDRAM component with 16 Gbit capacity, organized as 1 G x 16. It features a maximum clock frequency of 2.133 GHz and operates within a voltage range of 1.06 V to 1.95 V. The device utilizes a TFBGA-200 package, supports surface mount installation, and functions between -40°C and +105°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via LPDDR4 interface technology
  • Designed for mobile applications requiring compact form factors
  • Operates reliably across extended industrial temperature ranges

Memory IC Applications

  • Mobile computing devices
  • Smartphones and tablets
  • Embedded systems

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging configuration. Confirm current availability status directly with Micron Technology Inc., as distribution channels may vary. Ensure compatibility with existing board designs regarding the TFBGA-200 footprint and pinout requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this part for designs requiring 16 Gbit density in a low-profile package. Verify system power supply stability within the 1.06 V to 1.95 V operating window. Ensure thermal management solutions accommodate the +105°C maximum junction temperature rating for reliable long-term operation in constrained environments.

Memory IC Part Context

This component belongs to Micron's LPDDR4 memory family, targeting mobile and embedded markets. It offers higher bandwidth efficiency compared to previous generations while maintaining low power consumption profiles suitable for battery-operated devices and space-constrained hardware implementations.

Memory IC Replacement Considerations

Consult official Micron documentation for qualified substitute part numbers. Verify electrical and mechanical compatibility before considering alternatives.

MT53E1G16D1FW-046 AAT:A TRMT53E1G16D1FW-046 AAT:A TR
$15.71
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