MT53E1G32D2FW-046 AAT:A TR

Memory IC Overview

The Micron MT53E1G32D2FW-046 AAT:A TR is a mobile LPDDR4 dynamic random-access memory component with a total storage capacity of 32 Gbit. It features a 32-bit data bus width and operates at a maximum clock frequency of 2.133 GHz. The device is organized as 1 G x 32 and utilizes a VFBGA-200 package. It supports a maximum supply voltage of 1.1 V and functions within an operating temperature range from -40°C to +105°C.

Memory IC Feature Summary

• Supports LPDDR4 interface for high-bandwidth mobile applications
• Integrated dual-die package (DDP) architecture for density scaling
• Extended industrial temperature rating for robust environmental operation

Memory IC Applications

• Smartphones and mobile communication devices
• Tablets and portable computing platforms
• Automotive infotainment systems requiring extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix AAT:A TR against official Micron documentation to confirm pinout, speed grade, and packaging configuration. Confirm end-of-life status as distribution sources indicate potential obsolescence. Ensure compatibility with system power delivery and thermal management requirements before integration.

Memory IC Selection Notes

Select this component when a 32 Gbit density in a compact VFBGA-200 form factor is required. The -105°C upper temperature limit distinguishes it from commercial-grade variants. Verify that the host controller supports LPDDR4 signaling standards and the specific organizational structure of 1 G x 32.

Memory IC Part Context

This part belongs to the Micron MT53E series of mobile LPDDR4 DRAMs. These components are designed for space-constrained mobile electronics requiring high performance and low power consumption. The series offers various densities and package options to support diverse application needs in the smartphone and tablet markets.

Memory IC Replacement Considerations

Consult Micron's official cross-reference tools for verified substitutes. Consider parts with identical VFBGA-200 footprint and LPDDR4 compatibility if sourcing is restricted due to end-of-life status.