Memory IC MT53E512M64D2HJ-046 AAT:B product image

MT53E512M64D2HJ-046 AAT:B

$26.46
  • Description:IC DRAM 32GBIT PAR 556WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Box

SKU:4299adc6c04e Category: Brand:

  
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MT53E512M64D2HJ-046 AAT:B is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 32GBIT PAR 556WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53E512M64D2HJ-046 AAT:B

  • Description:IC DRAM 32GBIT PAR 556WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Box
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4X
  • Memory Size:32Gbit
  • Memory Organization:512M x 64
  • Memory Interface:Parallel
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:18ns
  • Voltage - Supply:1.06V ~ 1.17V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:556-TFBGA
  • Supplier Device Package:556-WFBGA (12.4x12.4)
  • Access Time:3.5 ns
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for MT53E512M64D2HJ-046 AAT:B

MT53E512M64D2HJ-046 AAT:B

Memory IC Overview

The MT53E512M64D2HJ-046 AAT:B is a Micron LPDDR4 SDRAM with 32 Gbit capacity and 64-bit bus width. It features a TFBGA-556 package, 2.133 GHz max clock frequency, and 3.5 ns access time. Operating voltage ranges from 1.06 V to 1.95 V, with a temperature range of -40°C to +105°C.

Memory IC Feature Summary

  • LPDDR4 mobile memory architecture
  • High-density 32 Gbit storage
  • Wide 64-bit data interface
  • Extended industrial temperature operation

Memory IC Applications

  • Mobile computing platforms
  • Automotive infotainment systems
  • Industrial embedded controllers

Memory IC Procurement Notes

Verify component authenticity through authorized Micron distributors or direct manufacturer channels. Confirm lot traceability and RoHS compliance documentation prior to integration. Ensure supply chain stability given potential end-of-life status indicated in public records.

Memory IC Selection Notes

Select this part for high-bandwidth mobile applications requiring wide data paths. The TFBGA-556 package suits dense PCB layouts. Verify thermal management capabilities for the +105°C maximum operating limit in enclosed environments.

Memory IC Part Context

This component belongs to the Micron MT53E series of LPDDR4 DRAMs. It provides high-performance memory solutions for mobile and automotive sectors. The specific suffix indicates package type and testing grade.

Memory IC Replacement Considerations

Public records indicate this part is approaching end-of-life. Consult Micron for current qualified substitutes within the MT53E family or newer LPDDR4X/LPDDR5 generations.

MT53E512M64D2HJ-046 AAT:BMT53E512M64D2HJ-046 AAT:B
$26.46
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