MT62F4G32D8DV-023 AIT:B

Memory IC Overview

The MT62F4G32D8DV-023 AIT:B is a Micron LPDDR5 SDRAM component with a total storage capacity of 128 Gbit. It features a memory organization of 4 G x 32 and utilizes a parallel interface. The device operates within an extended industrial temperature range, supporting minimum and maximum operating temperatures of -40°C and +95°C respectively. Key electrical parameters include a maximum clock frequency of 4.266 GHz, with power supply voltage ranging from a minimum of 1.01 V to a maximum of 1.12 V. The component is housed in a 315-ball LFBGA package designed for surface mount technology.

Memory IC Feature Summary

• Supports high-speed data transfer rates up to 4.266 GHz for enhanced bandwidth performance
• Designed for operation in extended industrial environments with wide thermal tolerance
• Utilizes low-voltage power supply specifications to optimize energy efficiency
• Integrates advanced error correction capabilities to ensure data integrity

Memory IC Applications

• Industrial automation systems requiring reliable memory under extreme conditions
• Automotive infotainment and telematics units
• Edge computing devices deployed in harsh environments
• Network infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix IT:B against official Micron documentation to confirm the exact temperature grade and quality level. Ensure compatibility with system power rails given the 1.01 V to 1.12 V operating window. Confirm package availability and lead times directly with authorized distributors or the manufacturer, as supply status may vary by region and production cycle.

Memory IC Selection Notes

Select this part when an LPDDR5 solution is required for applications demanding both high bandwidth and extended industrial temperature stability. The 128 Gbit density suits complex processing tasks in compact form factors. Verify that the host controller supports the 32-bit bus width and 4.266 GHz speed requirements. Ensure PCB layout accommodates the 315-ball LFBGA footprint and thermal management needs for sustained operation at elevated temperatures.

Memory IC Part Context

This component belongs to Micron's LPDDR5 family, targeting mobile and embedded markets. It represents a generation of memory offering significant performance improvements over previous standards while maintaining low power consumption. The specific model integrates high-density storage with robust environmental ratings suitable for demanding industrial and automotive sectors.

Memory IC Replacement Considerations

Consult Micron's official obsolescence notices for direct replacements. Cross-reference pinouts and electrical characteristics carefully if considering alternative vendors. Verify that any substitute maintains the same 315-ball LFBGA package and LPDDR5 protocol compatibility.