MTLW-130-06-G-S-150

Headers, Male Pins Overview

The MTLW-130-06-G-S-150 is a board stacking connector manufactured by Samtec. It features 30 contacts arranged in a single row with male gender and straight orientation. The termination method is solder, utilizing phosphor bronze contacts with gold over nickel plating. This component is designed for vertical assembly on printed circuit boards.

Headers, Male Pins Feature Summary

• Elastic stacking design allows variable pin height adjustment
• Utilizes .025 inch square posts for reliable connection
• Supports flexible placement posture during assembly

Headers, Male Pins Applications

• Board-to-board stacking connections
• Vertical interconnect applications
• High-density PCB assemblies

Headers, Male Pins Procurement Notes

Verify the exact suffix against official Samtec documentation to confirm lead time and availability status. Ensure the specified contact count and pitch match the design requirements. Confirm RoHS compliance and material specifications align with project constraints before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when variable pin height flexibility is required for board stacking. The elastic design accommodates slight misalignments between stacked boards. Verify that the straight male configuration and solder termination are compatible with the target PCB layout and assembly process.

Headers, Male Pins Part Context

This part belongs to the MTLW series of .100" pitch low-profile headers. The series is characterized by its unique elastic stacking capability, allowing for adjustable pin heights. It serves as a specialized solution for complex multi-layer board interconnections where standard rigid headers may not suffice.

Headers, Male Pins Replacement Considerations

Consult the official Samtec catalog for direct substitutes within the MTLW family. Verify compatibility with mating connectors such as the SLW series. Ensure any replacement maintains the same pitch, contact count, and stacking height capabilities.