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NB3L553MNR4G is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC CLK BUFFER 1:4 200MHZ 8DFN. Review the specifications below when checking this part for your BOM.
The NB3L553MNR4G is a low skew 1-to-4 clock fanout buffer manufactured by onsemi. It supports operating voltages of 2.5 V, 3.3 V, and 5.0 V with a supply range of 2.375 V to 5.25 V. The device handles input/output clock frequencies up to 200 MHz. Key electrical parameters include typical output-to-output skew of 35 ps and RMS phase jitter of 18 fs at 3.3 V or 29 fs at 5.0 V (integrated 12 kHz–20 MHz). It features a 5 V tolerant ICLK input and three-state outputs controlled by an OE pin. The component is housed in an 8-pin DFN package.
Verify the ordering suffix MNR4G corresponds to the DFN-8 package and tape & reel shipping configuration. Confirm the device meets Pb-Free requirements and industrial temperature range specifications (-40°C to +85°C) as stated in the datasheet attributes. Ensure thermal management considerations are addressed for the exposed pad in the DFN8 package.
Select this component when a 1:4 fanout buffer with low skew is required for 2.5 V, 3.3 V, or 5.0 V systems. It is suitable for applications needing high-frequency clock distribution up to 200 MHz. Consider the DFN-8 package size and thermal resistance characteristics if space or heat dissipation is a constraint compared to the SOIC-8 alternative.
The NB3L553MNR4G belongs to the NB3L553 family of clock fanout buffers. It is functionally similar to other devices in the series but differs in packaging and shipping format. The 'MNR4G' suffix specifically denotes the DFN-8 package and tape & reel quantity, distinguishing it from the DG (SOIC-8 rail) or DR2G (SOIC-8 tape & reel) variants.
Direct package-compatible replacements are not explicitly listed in the provided documentation. Functionally similar 1:4 clock buffers from onsemi or other manufacturers should be evaluated for voltage compatibility, skew performance, and package dimensions before substitution.
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