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NRF52810-CAAA-R is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Nordic Semiconductor ASA. Its product description is IC RF TXRX+MCU BLE 33WLCSP. Review the specifications below when checking this part for your BOM.
The NRF52810-CAAA-R is a Bluetooth Low Energy system-on-chip from Nordic Semiconductor, featuring an ARM Cortex-M4 processor running at 64 MHz. It integrates 192 kB of flash memory and 24 kB of RAM within a compact 33-WLCSP package measuring 2.48 x 2.46 mm. The device supports Bluetooth 5.0 with a maximum data rate of 2 Mbps and includes a 2.4 GHz transceiver with +4 dBm output power and -96 dBm sensitivity. Operating voltage ranges from 1.7 V to 3.6 V, with receive current at 4.6 mA and transmit current between 4.6 mA and 7 mA.
Verify the specific suffix 'CAAA' corresponds to the 33-WLCSP package variant when sourcing. Confirm that the component meets RoHS3 compliance standards required for your manufacturing process. Ensure compatibility with the nRF Connect SDK for software development. Check moisture sensitivity level (MSL 1) handling requirements during assembly to prevent damage.
Select this model for applications prioritizing minimal footprint due to its ultra-small WLCSP packaging. It serves as a cost-effective baseline for the nRF52 series, suitable for less complex Bluetooth implementations. Consider alternative packages like QFN if larger pin counts or different thermal properties are needed for the specific PCB layout constraints.
This component belongs to the nRF52 series, designed as a baseline member for Bluetooth Low Energy applications. It shares core architecture with other nRF52 variants but offers reduced memory and peripheral options to lower costs. It is widely used in IoT ecosystems where size and power efficiency are critical design parameters.
Direct substitutes include other nRF52810 variants with different package types, such as NRF52810-QCAA-R or NRF52810-QFAA-R. These alternatives maintain identical functional specifications but differ in physical footprint and pin configuration. Verify package compatibility before swapping components in existing designs.
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