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NTS0102TLH is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC TRANSLTR BIDIRECTIONAL 8XSON. Review the specifications below when checking this part for your BOM.
The NTS0102TLH is a dual-supply translating transceiver in an XSON8 package (SOT1052-2). It provides bidirectional voltage level translation between VCC(A) (1.65 V to 3.6 V) and VCC(B) (2.3 V to 5.5 V), supporting nodes such as 1.8 V, 2.5 V, 3.3 V, and 5.0 V. The device features two 2-bit input-output ports, auto direction sensing, and an active HIGH output enable (OE). It supports push-pull data rates up to 50 Mbit/s and includes IOFF circuitry for partial power-down applications.
Verify the specific ordering part number against the required package variant, as the NTS0102 family utilizes multiple distinct packages including TSSOP8, XSON8, and X2SON8. Confirm that the TL package center pad requirements align with the target PCB layout, particularly regarding traces underneath the component footprint. Ensure environmental compliance certificates match project specifications.
Select this component when interfacing systems operating at different supply voltages requiring open-drain or push-pull drivers. The device is suitable for point-to-point applications where automatic direction detection is preferred over manual control. Consider the thermal derating characteristics of the XSON8 package if operating near maximum ambient temperature limits.
The NTS0102TLH belongs to the NTS0102 series of dual-supply translating transceivers manufactured by NXP Semiconductors. This series is designed to facilitate communication between digital logic circuits running at varying voltage levels. The TL designation specifically identifies the plastic extremely thin small outline package with no leads and eight terminals.
The NTS0102GD is a documented drop-in replacement. The TL package includes a center pad not electrically connected to silicon, whereas the GD package lacks this feature. Verify PCB trace presence under the footprint to assess potential EMI risks before substitution.
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