Microprocessors OMAPL137DZKBT3 product image

OMAPL137DZKBT3

  • Description:IC MPU OMAP-L1X 375MHZ 256BGA
  • Series:OMAP-L1x
  • Mfr:Texas Instruments
  • Package:Tray

SKU:ce89057e2f8c Category: Brand:

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OMAPL137DZKBT3 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC MPU OMAP-L1X 375MHZ 256BGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for OMAPL137DZKBT3

  • Description:IC MPU OMAP-L1X 375MHZ 256BGA
  • Series:OMAP-L1x
  • Mfr:Texas Instruments
  • Package:Tray
  • Core Processor:ARM926EJ-S
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:375MHz
  • Co-Processors/DSP:Signal Processing; C674x, System Control; CP15
  • RAM Controllers:SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:LCD
  • Ethernet:10/100Mbps (1)
  • SATA:-
  • USB:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O:1.8V, 3.3V
  • Operating Temperature:-40°C ~ 125°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-BGA (17x17)
  • Additional Interfaces:HPI, I2C, McASP, MMC/SD, SPI, UART
  • Grade:-
  • Qualification:-

Microprocessors datasheet and documents for OMAPL137DZKBT3

OMAPL137DZKBT3

Microprocessors Overview

The OMAPL137DZKBT3 is a microprocessor unit from the Texas Instruments OMAP-L1x series. It integrates an ARM926EJ-S core operating at 375MHz with a C674x DSP core. The device utilizes a 256-BGA package measuring 17x17 mm. It supports 1.8V and 3.3V I/O voltages and operates within a temperature range of -40°C to 105°C TJ.

Microprocessors Feature Summary

  • Combines ARM926EJ-S application processor with C674x digital signal processing capabilities
  • Includes integrated SDRAM controller for memory management
  • Supports multiple communication interfaces including USB, Ethernet, and MMC/SD

Microprocessors Applications

  • Industrial control systems requiring mixed signal processing
  • Video surveillance equipment utilizing DSP acceleration
  • Medical imaging devices needing high-performance embedded processing

Microprocessors Procurement Notes

Verify the specific suffix 'T3' against official datasheets to confirm tape-and-reel packaging specifications. Ensure compatibility with existing board layouts regarding the 256-BGA footprint and thermal requirements. Cross-reference ordering information directly with Texas Instruments documentation to avoid discrepancies in package variants.

Microprocessors Selection Notes

Select this component when both general-purpose computing and intensive digital signal processing are required on a single chip. The integration of ARM and C674x cores reduces system complexity compared to discrete solutions. Consider the 256-BGA package constraints and thermal dissipation needs for the specified operating temperature range during design.

Microprocessors Part Context

This part belongs to the OMAP-L1x family, designed for applications demanding low power consumption alongside high performance. It serves as a bridge between traditional microcontrollers and complex system-on-chip solutions, offering dedicated hardware accelerators for video and audio processing tasks.

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