Memory IC PC28F00AP30TFA product image

PC28F00AP30TFA

  • Description:IC FLASH 1GBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:3d9b85a30871 Category: Brand:

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PC28F00AP30TFA is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 1GBIT PAR 64EASYBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for PC28F00AP30TFA

  • Description:IC FLASH 1GBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:52 MHz
  • Write Cycle Time - Word, Page:100ns
  • Voltage - Supply:1.7V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-TBGA
  • Supplier Device Package:64-EasyBGA (8x10)
  • Access Time:100 ns

Memory IC datasheet and documents for PC28F00AP30TFA

PC28F00AP30TFA

Memory IC Overview

The PC28F00AP30TFA is a 1 Gbit (64 M x 16) NOR Flash memory device manufactured by Micron Technology. It utilizes parallel interface technology and is housed in a 64-EasyBGA package with dimensions of 8x10 mm. The component operates within a supply voltage range of 1.7 V to 2.0 V and supports a clock frequency of 52 MHz. It features an access time of 100 ns and a write cycle time of 100 ns. The device is rated for an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports synchronous-burst read mode with zero wait states at 52 MHz
  • Includes buffered enhanced factory programming capabilities
  • Features individual zero-latency block locking

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Industrial control applications
  • Automotive electronics

Memory IC Procurement Notes

Verify the specific suffix 'TFA' against official Micron documentation to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with the required 1.7 V to 2.0 V power domain. Confirm that the 64-EasyBGA footprint matches the target PCB design constraints. Check for any regional compliance requirements relevant to the manufacturing origin.

Memory IC Selection Notes

Select this component when a 1 Gbit density is required with a narrow 1.7 V to 2.0 V supply voltage profile. The 64-EasyBGA package offers a compact form factor suitable for space-constrained designs. Consider the 100 ns access time for system timing budgets. Verify that the parallel interface architecture aligns with the host controller's memory bus capabilities.

Memory IC Part Context

This part belongs to Micron's NOR Flash family, specifically designed for embedded applications. It shares architectural similarities with other devices in the Axcell series but is distinguished by its specific voltage range and package configuration. The device provides high-performance read modes and reliable programming features for critical data storage.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.

PC28F00AP30TFAPC28F00AP30TFA

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