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PI3EQX7502AIZDE+DAX is listed in the Signal Buffers, Repeaters, Splitters range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is IC REDRIVER USB 3.0 2CH 24TQFN. Review the specifications below when checking this part for your BOM.
The PI3EQX7502AIZDE+DAX is a single-port USB 3.0 ReDriver manufactured by Diodes Incorporated, designed to extend the reach of high-speed serial signals. It operates within an ambient temperature range of -40°C to +85°C and utilizes a 24-pin TQFN package with dimensions of 4x4 mm. The device supports data rates up to 5 Gbps for USB 3.0 compliance. It is supplied in tape and reel packaging with a standard factory quantity of 3,500 units per reel. The component integrates input equalization and output pre-emphasis capabilities to mitigate channel loss.
Verify the specific suffix DAX confirms the tape and reel packaging configuration with a 3,500-unit quantity. Ensure compatibility with the target PCB land pattern for the 24-pin TQFN package. Confirm RoHS compliance status matches project requirements. Check for any recent product change notices regarding pinout or electrical specifications before finalizing procurement orders.
Select this component when a single-channel solution for USB 3.0 signal restoration is required. Compare power consumption figures against alternative redrivers if battery life is critical. Verify that the operating temperature range meets the environmental conditions of the end application. Consider the availability of evaluation boards for initial circuit validation.
This part belongs to the PI3EQX series of USB 3.0 Redrivers from Diodes Incorporated. It serves as a signal conditioning IC specifically engineered for USB 3.0 interfaces. The series includes variants with different packaging options and thermal characteristics. It complements other interface solutions like switches and multiplexers in complete USB subsystem designs.
Check for direct pin-to-pin replacements within the PI3EQX family. Verify functional equivalence for USB 3.0 signaling speeds. Review datasheets for differences in supply voltage ranges and thermal performance. Confirm package dimensions match existing footprints to avoid re-spinning hardware.
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