QN9080CHNY

RF Transceiver ICS Overview

The QN9080CHNY is an ultra-low power Bluetooth 5 system-on-chip solution by NXP. It integrates a BLE 5 radio with a maximum data rate of 2 Mbps and an output power of 2 dBm, achieving a sensitivity of -91.5 dBm. The device operates on a supply voltage range of 1.62 V to 3.6 V, drawing 5 mA during reception and 3.5 mA during transmission. It features 512 KB of flash and 128 KB of RAM, housed in a 48-pin HVQFN package with an exposed pad. The operating temperature range spans from -40°C to 85°C.

RF Transceiver ICS Feature Summary

• Supports Bluetooth 5 protocol with enhanced speed capabilities
• Integrates substantial memory resources for complex application logic
• Designed for ultra-low power consumption in battery-operated devices

RF Transceiver ICS Applications

• Wireless sensor networks
• Smart home IoT devices
• Wearable health monitors

RF Transceiver ICS Procurement Notes

Verify the specific suffix CHNY against official NXP documentation to confirm pinout and package configuration. Ensure compatibility with the required 48-VFQFN footprint. Confirm that the selected variant meets the necessary regulatory certifications for your target market before finalizing procurement orders.

RF Transceiver ICS Selection Notes

Select this component when Bluetooth 5 support and low power efficiency are critical. Consider the 48-pin package size constraints and the need for integrated memory. Evaluate if the 2 dBm output power suffices for the intended communication range compared to higher-power alternatives.

RF Transceiver ICS Part Context

This part belongs to the QN908x series of RF System on Chips. It serves as a complete solution for Bluetooth Low Energy applications, combining the transceiver, ARM Cortex-M0+ processor, and necessary peripherals into a single compact package for efficient embedded design.

RF Transceiver ICS Replacement Considerations

QN9080DHN is a related variant within the same family. Verify pin compatibility and software library support before substitution. Ensure the alternative package type matches the existing PCB layout requirements.