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RM232-040-101-2900 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM232-040-101-2900. Review the specifications below when checking this part for your BOM.
The AirBorn RM232-040-101-2900 is a rectangular MIL-spec connector from the R Series, designed for board mount plug applications. It features a dual-row configuration with 40 positions and a 1.91 mm (0.075 inch) pitch. The component utilizes through-hole termination with gold-plated contacts and a polyphenylene sulfide (PPS) plastic body. Rated for 3 A current and 750 V voltage, it operates within a temperature range of -65 °C to +125 °C. This straight-mount connector complies with MIL-DTL-55302 standards.
Verify the specific ordering suffix against the manufacturer datasheet to ensure correct contact plating and termination style. Confirm RoHS compliance status as some variants may differ. Check for active product change notifications that might affect material composition or manufacturing location before finalizing procurement orders.
Select this model for applications requiring a 40-position dual-row plug with a 1.91 mm pitch. Ensure the mating receptacle matches the R Series form factor. Verify that the through-hole footprint aligns with the PCB layout constraints. Consider the 3 A current rating when designing thermal management strategies for high-load scenarios.
This component belongs to the AirBorn R Series, a line of rectangular connectors known for their compact size and high reliability. The series is widely used in aerospace and defense sectors where space constraints and environmental resilience are critical. The RM232 prefix indicates a specific plug configuration within this broader family.
Direct substitutes must match the MIL-DTL-55302 specification, 40-position count, and 1.91 mm pitch. Cross-reference with other manufacturers offering equivalent rectangular MIL-spec plugs. Verify that any alternative part maintains the same contact material and plating thickness to ensure interface compatibility.
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