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RM322-206-211-5504 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM322-206-211-5504. Review the specifications below when checking this part for your BOM.
The RM322-206-211-5504 is a rectangular MIL-spec connector from the AirBorn R Series, manufactured by Molex. It is a board mount plug with a right-angle orientation and a plastic body. The component features 206 circuits arranged in three rows with a 0.075-inch (1.91 mm) pitch. It utilizes through-hole termination with gold plating on contacts and includes mounting ears for secure installation. The design incorporates a guide set and polarization 4 configuration to ensure correct mating alignment.
Verify current availability directly with Molex or authorized distributors, as this part may be subject to specific manufacturing lead times. Confirm that the polarization code matches the system requirements. Ensure the right-angle form factor fits within the mechanical envelope of the target application before finalizing procurement.
Select this connector when a high-density, ruggedized interface is required for military or aerospace applications. The 206-circuit capacity supports complex signal routing. Verify that the PCB layout accommodates the right-angle footprint and that the through-hole process aligns with assembly capabilities. Ensure environmental ratings meet operational temperature extremes.
This component belongs to the AirBorn R Series, a line of rectangular connectors designed to meet MIL-DTL-55302 specifications. The series is known for high reliability in harsh environments. As a Molex company product, it integrates advanced engineering standards with established military connector performance criteria for critical infrastructure.
Cross-reference with other MIL-DTL-55302 compliant connectors if supply chain constraints exist. Verify that any substitute maintains the same 206-circuit count, 0.075-inch pitch, and polarization scheme to ensure mechanical and electrical compatibility without redesigning the host board.
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