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RM332-059-181-5900 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM332-059-181-5900. Review the specifications below when checking this part for your BOM.
The RM332-059-181-5900 is a rectangular MIL-spec connector from the AirBorn R Series, manufactured by Molex. It features a straight PCB mount configuration with 59 positions arranged in three rows. The connector utilizes crimp termination for pin contacts made of copper with gold plating. Designed for robust performance, it operates within a temperature range of -65°C to +125°C and supports wire gauges from 26 AWG to 24 AWG. Key electrical specifications include a current rating of 3 A and a voltage rating of 83 V, with an insulation resistance of 5 GOhms.
Verify RoHS compliance status through official documentation as indicated by 'Details' rather than standard certification labels. Confirm that the specific ordering suffix matches the required contact configuration and termination style. Ensure compatibility with mating receptacles within the same R-Series family to maintain interface integrity.
Select this component when a straight-mount, 59-position connector is required for board-level integration. The choice depends on the need for crimp termination and specific current ratings. Evaluate the 1.9 mm pitch against available board space constraints. Consider the operating temperature limits relative to the environmental conditions of the target application.
This part belongs to the AirBorn R Series, a line of high-density rectangular connectors known for durability. The series is widely used in aerospace and defense sectors where vibration resistance and reliable signal transmission are critical. The manufacturer, Molex / AirBorn, specializes in rugged interconnect solutions.
Substitute parts must match the 59-position count, 3-row layout, and MIL-DTL-55302 specification. Verify identical mounting style and contact type to ensure mechanical and electrical compatibility without redesigning the host assembly.
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