S25FS512SAGNFI013

Memory IC Overview

The S25FS512SAGNFI013 is a 512Mb (64M x 8) NOR Flash memory IC from the FS-S series, manufactured by Infineon Technologies. It features SPI and Quad I/O interfaces with a maximum clock frequency of 133 MHz. The device operates within a supply voltage range of 1.7V to 2V and supports an industrial operating temperature range of -40°C to +85°C. It is housed in an 8-WSON (6x8) package with exposed pad.

Memory IC Feature Summary

• Supports standard SPI, Dual I/O, and Quad I/O interface modes for flexible system integration.
• Features high-speed serial access capabilities up to 133 MHz clock frequency.
• Designed for industrial applications with extended temperature range operation.
• Utilizes MirrorBit technology for non-volatile data retention.

Memory IC Applications

• Industrial control systems requiring reliable code storage
• Automotive electronics operating in harsh environments
• Consumer devices needing compact flash memory solutions
• Network infrastructure equipment

Memory IC Procurement Notes

Verify the complete part number including suffixes against official Infineon documentation to ensure correct package, temperature grade, and tape/reel specifications. Confirm RoHS compliance status and lead-free requirements prior to ordering. Check for any specific quality certifications required by your industry standards.

Memory IC Selection Notes

Select this component when a 512Mb capacity with low voltage operation (1.7V-2V) is required. Ensure the design supports the 8-WSON package dimensions. Verify that the host controller can support the necessary SPI/Quad I/O protocols at the specified clock speeds.

Memory IC Part Context

This part belongs to the S25FS512S family of NOR Flash memories. It shares architectural similarities with other members of the FS-S series but differs in specific package options and operational parameters. It is distinct from the S25FL series which typically operates at higher voltages.

Memory IC Replacement Considerations

Check for direct pin-to-pin replacements within the same density and voltage range. Verify compatibility with existing firmware if replacing a different manufacturer's part. Consider thermal performance differences between packages.