S29GL128P10FFI020

$5.45

Description：IC FLASH 128MBIT PARALLEL 64FBGA
Series：GL-P
Mfr：Infineon Technologies
Package：Tray

SKU:7309c4f7a837 Category: Memory IC Brand: Infineon Technologies

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Product introduction

S29GL128P10FFI020 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 128MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL128P10FFI020

Description：IC FLASH 128MBIT PARALLEL 64FBGA
Series：GL-P
Mfr：Infineon Technologies
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：128Mbit
Memory Organization：16M x 8
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：100ns
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：64-LBGA
Supplier Device Package：64-FBGA (13x11)
Access Time：100 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for S29GL128P10FFI020

S29GL128P10FFI020

Memory IC Overview

The S29GL128P10FFI020 is a 128 Mbit NOR Flash memory device manufactured using 90 nm MirrorBit process technology. It features a 64-ball Fortified Ball Grid Array (FBGA) package with dimensions of 11 x 13 mm and a 1.0 mm pitch. The device operates on a single 3V supply within the range of 2.7 V to 3.6 V. It supports an asynchronous parallel interface with a maximum random access time of 100 ns and a page access time of 25 ns. The memory organization consists of uniform 64 Kword sectors, providing a total capacity of 128 Mbit.

Memory IC Feature Summary

Supports fast page mode read operations for efficient data retrieval within specific address ranges.
Includes a write buffer that allows multiple words to be programmed in a single operation to reduce programming time.
Features VersatileIO control allowing I/O signal levels to operate from 1.65 V up to the VCC supply voltage.
Provides advanced sector protection methods including persistent and password-based locking mechanisms.

Memory IC Applications

Embedded systems requiring high-density code storage
Applications needing fast random access and page mode reads
Industrial embedded designs demanding robust sector protection

Memory IC Procurement Notes

Verify the specific ordering suffix requirements against the manufacturer's current datasheet to ensure compatibility with voltage ranges and package types. Confirm availability status as product lifecycles may change. Ensure proper handling procedures are followed for BGA packages during assembly to prevent damage.

Memory IC Selection Notes

Select this component when a 128 Mbit density with 90 nm MirrorBit technology is required. The FBGA package is suitable for surface-mount applications. Consider the VersatileIO feature if interfacing with lower voltage logic. Verify that the 100 ns access time meets system timing constraints.

Memory IC Part Context

This part belongs to the S29GL-P family of 3.0 Volt Page Flash memories. The family includes densities ranging from 128 Mbit to 1 Gbit. All devices share the same 90 nm MirrorBit manufacturing process and similar command sets, facilitating design scalability across different storage requirements within the same product line.