Memory IC S29GL512N11FFA022 product image

S29GL512N11FFA022

  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-N
  • Mfr:Infineon Technologies
  • Package:Tray

SKU:0c2a2cf58ceb Category: Brand:

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S29GL512N11FFA022 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 512MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL512N11FFA022

  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-N
  • Mfr:Infineon Technologies
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:64M x 8, 32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:110ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LBGA
  • Supplier Device Package:64-FBGA (13x11)
  • Access Time:110 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S29GL512N11FFA022

S29GL512N11FFA022

Memory IC Overview

The S29GL512N11FFA022 is a 512 Mbit NOR flash memory IC from Infineon Technologies, organized as 64 Megawords by 8 bits or 32 Megawords by 16 bits. It utilizes a parallel interface with asynchronous timing and features a 64-pin FBGA package measuring 13x11 mm. The device operates within a voltage range of 2.7 V to 3.6 V, drawing a maximum active read current of 60 mA. It supports data bus widths of 8-bit or 16-bit and has a speed of 110 ns. The component is qualified under AEC-Q100 standards and functions reliably between -40°C and +105°C.

Memory IC Feature Summary

  • Supports flexible memory organization for 8-bit or 16-bit data buses
  • Integrated safety features compliant with automotive reliability standards
  • Asynchronous parallel interface for direct system integration

Memory IC Applications

  • Automotive electronic control units requiring PNOR storage
  • Industrial systems needing non-volatile code execution
  • Embedded applications utilizing floating gate technology

Memory IC Procurement Notes

Verify the specific suffix configuration against the official Infineon datasheet to ensure compatibility with your system requirements. Confirm that the 64-FBGA (13x11) package dimensions align with your PCB layout constraints. Ensure that the operating temperature range meets your environmental specifications before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 512 Mbit capacity with parallel interface is required for automotive or industrial environments. Consider the 110 ns access time and 60 mA active current consumption during power budgeting. Verify that the 2.7 V to 3.6 V supply voltage matches your system's power rails and that the FBGA-64 footprint is available in your design.

Memory IC Part Context

This part belongs to the S29GL512S/T series of NOR flash memories manufactured using 65nm process lithography and floating gate technology. It is designed for high-reliability applications, offering robust data retention and endurance characteristics typical of Infineon's FL-L family products.

Memory IC Replacement Considerations

Consult Infineon documentation for verified cross-reference part numbers. Ensure any substitute maintains the same 64-FBGA package, 512 Mbit density, and AEC-Q100 qualification status.

S29GL512N11FFA022S29GL512N11FFA022

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