SL 10 SMD 040 21 G SM

Headers, Male Pins Overview

The Fischer Elektronik SL 10 SMD 040 21 G SM is a surface mount board-to-board connector header. It features 21 positions with a 0.100 inch (2.54 mm) pitch. The component utilizes a single row configuration for vertical mounting. Contact plating includes gold over nickel to ensure reliable electrical performance and corrosion resistance. The design supports automated pick-and-place assembly processes.

Headers, Male Pins Feature Summary

• Surface mount construction enables direct PCB integration
• Gold-plated contacts provide durable electrical connections
• Single row layout facilitates compact circuit board designs

Headers, Male Pins Applications

• Board-to-board interconnections in electronic assemblies
• Wire-to-board connections requiring surface mount technology
• Automated manufacturing environments utilizing pick-and-place equipment

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix against official datasheets to confirm contact plating thickness and material composition. Ensure the selected variant matches the required pitch and position count for the target application. Confirm compatibility with standard reflow soldering profiles during procurement planning.

Headers, Male Pins Selection Notes

Select this component when surface mount technology is required for board-to-board connectivity. Consider the 2.54 mm pitch for standard spacing requirements. Evaluate the gold plating option for applications demanding high reliability and long-term corrosion resistance compared to tin-only alternatives.

Headers, Male Pins Part Context

This part belongs to the SL 10 SMD series from Fischer Elektronik, designed for compact electronic applications. The series offers various position counts and pitch options. The SL 10 SMD 040 variant specifically addresses needs for small-footprint connectors in dense circuit layouts.

Headers, Male Pins Replacement Considerations

Direct substitutes require matching the 2.54 mm pitch, 21-position count, and surface mount orientation. Verify that alternative headers support identical soldering profiles and mechanical retention methods to ensure functional equivalence.