SL 10 SMD 062 23 G

Headers, Male Pins Overview

The SL 10 SMD 062 23 G is a surface-mount male header connector from Fischer Elektronik. It features 23 positions with a 0.100 inch (2.54 mm) pitch. The component utilizes brass contacts with gold plating for reliable signal transmission. Designed for PCB integration, it supports automated pick-and-place assembly via bar magazine packaging. The connector ensures secure mating with female headers in electronic assemblies.

Headers, Male Pins Feature Summary

• Surface-mount design for automated PCB assembly
• Gold-plated brass contacts for conductivity
• Standard 0.100 inch (2.54 mm) pin spacing

Headers, Male Pins Applications

• General-purpose electronic circuit interconnects
• Industrial control board connections
• Consumer electronics module interfaces

Headers, Male Pins Procurement Notes

Verify the specific contact count and plating thickness against the manufacturer's datasheet before procurement. Ensure compatibility with mating female connectors regarding pitch and housing dimensions. Confirm that the surface-mount footprint matches the target PCB layout to prevent assembly errors.

Headers, Male Pins Selection Notes

Select this component when surface-mount technology is required for high-density connections. Consider the mechanical stability provided by the SMD termination style during reflow soldering. Evaluate the operating temperature range and current ratings to ensure suitability for the specific application environment.

Headers, Male Pins Part Context

This part belongs to the SL 10 SMD 062 series of male headers. The series offers various position counts to accommodate different circuit requirements. Fischer Elektronik designs these connectors for robust performance in demanding electronic environments.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other 23-position SMD male headers with identical 2.54 mm pitch. Verify that alternative components match the original height and terminal configuration for direct replacement without PCB redesign.