SL 10 SMD 104 9 G

Headers, Male Pins Overview

The SL 10 SMD 104 9 G is a surface mount board-to-board connector from Fischer Elektronik. It features a single row of nine male contacts with a 2.54 mm pitch spacing. The contact surfaces are gold-plated, and the housing utilizes polyamide insulation rated for operating temperatures between -40°C and +163°C. Designed for push-pull fastening, this component ensures reliable electrical interconnection in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Gold-plated male contacts ensure stable signal transmission
• Surface mount design facilitates automated PCB assembly
• Polyamide insulation provides thermal stability up to 163°C

Headers, Male Pins Applications

• Board-to-board interconnections
• Wire-to-board connections
• Compact electronic device assembly

Headers, Male Pins Procurement Notes

Verify that the specific suffix 'G' corresponds to the required gold plating specification. Confirm the exact pin count matches the application requirements. Ensure compatibility with standard pick-and-place equipment. Check datasheet for reflow soldering profile limits. Validate insulation material ratings against environmental conditions.

Headers, Male Pins Selection Notes

Select this model when a single-row surface mount header is required. Choose based on the 2.54 mm pitch requirement. Consider the gold plating for corrosion resistance. Evaluate the push-pull locking mechanism for secure mating. Assess the temperature range suitability for the operational environment.

Headers, Male Pins Part Context

This component belongs to the SL 10 SMD series of male headers. The series offers various contact counts and plating options. It is designed for high-density PCB applications. The product line emphasizes reliability and ease of assembly. Fischer Elektronik manufactures these connectors for industrial use.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other single-row SMD headers with 2.54 mm pitch. Verify matching dimensions for footprint compatibility. Ensure equivalent current and voltage ratings. Check for similar locking mechanisms. Confirm compatible termination methods.