SL 11 SMD 040 18 G SM

Headers, Male Pins Overview

The SL 11 SMD 040 18 G SM is a surface-mount header connector manufactured by Fischer Elektronik. It features 18 positions with a 0.100 inch (2.54 mm) pitch. The connector utilizes gold-plated tin-copper contacts and a polyamide insulation material rated for temperatures between -40°C and +163°C. Designed for reliable PCB integration, it supports standard reflow soldering processes.

Headers, Male Pins Feature Summary

• Surface-mount design for automated PCB assembly
• Gold-plated contact surfaces for corrosion resistance
• Polyamide insulation for thermal stability

Headers, Male Pins Applications

• Compact electronic device interconnects
• Industrial control board connections
• Consumer electronics module interfaces

Headers, Male Pins Procurement Notes

Verify the specific suffix 'G SM' against the manufacturer's official datasheet to confirm plating thickness and reel packaging details. Ensure compatibility with the target PCB footprint dimensions and soldering profile requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mount male header is required for high-density applications. The 2.54 mm pitch ensures broad compatibility with standard ribbon cables and mating connectors. Verify that the operating temperature range meets the environmental demands of the end product.

Headers, Male Pins Part Context

This part belongs to the SL 11 SMD series, which provides robust surface-mount solutions from Fischer Elektronik. The series is characterized by its compact form factor and durable construction, suitable for modern electronics manufacturing where space constraints and reliability are critical factors in connector selection.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 18-position count, 2.54 mm pitch, and surface-mount configuration. Verify that alternative manufacturers offer identical pinout arrangements and mechanical locking features to ensure seamless integration without redesigning the PCB layout.