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SM-K26-XCL2GC-ED is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists AMD. Its product description is SOM K26C VISION ZYNQ MPSOC ED. Review the specifications below when checking this part for your BOM.
The AMD SM-K26-XCL2GC-ED is a commercial-grade Kria K26 System-on-Module (SOM) designed for edge vision applications. It integrates the Zynq UltraScale+ MPSoC, featuring a quad-core Arm Cortex-A53 processor up to 1.5 GHz and dual-core Cortex-R5F real-time processors up to 600 MHz. The module includes 4 GB of 64-bit DDR4 memory and 16 GB eMMC storage. Key hardware accelerators include a Video Codec Unit (VCU) supporting up to 32 streams at 4Kp60 resolution and 1,248 DSP slices. It operates within a temperature range of 0°C to 85°C, with general power consumption at 7.5W and maximum power at 15W.
Verify the specific suffix '-ED' against official AMD documentation to confirm if it denotes a specific packaging, testing, or regional variant distinct from the standard SM-K26-XCL2GC. Confirm lead times and availability through authorized distributors, as supply chain data varies by region and time.
Select this commercial-grade SOM for applications requiring operation between 0°C and 85°C. For environments requiring -40°C to 100°C operation, consider the industrial-grade SM-K26-XCL2GI variant. Ensure the carrier board design supports the required PCIe Gen2 x4, USB 3.0, and Gigabit Ethernet interfaces provided by the PS MIO and GTR pins.
This component belongs to the AMD Kria K26 family of adaptive system modules. It is optimized for edge AI and vision workloads, leveraging the underlying Zynq UltraScale+ MPSoC architecture. The Kria platform provides certified modules to accelerate deployment in production environments compared to development kits like the KV260.
The industrial-grade equivalent is the SM-K26-XCL2GI, which offers an extended temperature range (-40°C to 100°C). Both share the same core SoC and pinout, facilitating potential form-factor compatibility if thermal management allows.
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